MyNexeo
Compre en 3D
Empleos
LinkedIn
Idioma 
Blog 
MyNexeo 
MyNexeo
Empleos
LinkedIn
Superior Strength, Stiffness, Heat Resistance and More
InStruc® structurally reinforced compounds represent a diverse family of high-performance thermoplastic compounds designed for a myriad of applications, including aerospace, automotive, electronics, healthcare, and industrial settings.
.jpg)
InStruc® stands out by offering a spectrum of superior qualities, including strength, stiffness, heat resistance, creep resistance, fatigue endurance, impact protection, and dimensional stability. These compounds, based on a variety of engineering resins, are not a singular product but a versatile line that can be customized with a wide array of additives to meet specific performance requirements.
InStruc® compounds are crafted from various engineering resins, including ABS, PC, nylon, POM, PPA, PES, PSU, PEEK, and more. The line's customizability extends to incorporating a diverse range of additives to tailor performance. Algunas características y propiedades que se encuentran en la línea de producto incluyen:
.jpg)
InStruc® is a material of choice for aerospace applications due to its lightweight nature, which contributes to improved fuel efficiency and reduced emissions. Additionally, its strength ensures protection for aircraft in the event of an accident. Furthermore, InStruc's® heat resistance capability safeguards aircraft from the extreme temperatures encountered during flight. Algunas aplicaciones usuales incluyen:
.jpg)
InStruc's® lightweight property plays a crucial role in enhancing fuel efficiency and reducing emissions in the automotive industry. Its durability extends the lifespan of automotive components, while its impact resistance provides protection for occupants in case of an accident. Common applications include:
.jpg)
The lightweight nature of InStruc® contributes to the miniaturization and portability of electronic devices. Its strength safeguards electronic devices from damage, and its heat resistance protects them from the heat generated by their components. Algunas aplicaciones comunes incluyen:
.jpg)
.jpg)
